Samsung Electronics has shared its latest developments in the foundry area, including the roadmap for mass chip manufacturing with the 2-nanometer process and expanding its function capacity with the opening of new production lines.

The South Korean company’s strategy seeks to consolidate its competitiveness in the foundry area, as it has highlighted in the framework of the seventh edition of the Samsung Foundry Forum, and where it has affirmed its intention to address the needs of customers in the era of artificial intelligence through advanced semiconductor technology.

At this event, Samsung shared that the mass production of mobile chips made with a 2-nanometer process will begin in 2025. This, in addition to reducing the area by 5 %, will increase performance by 12 % and energy efficiency. by 25 %.

The company plans to extend the 2-nanometer process one later to high-performance computing and in 2027 to the automotive sector, the year in which mass production of the 1.4-nanometer process will also begin, as stated in a statement.

In 2025, it also expects to have 5-nanometer RF chips ready for 6G connectivity, and start foundry services for 8-inch GaN chips, as well as expand 8- and 14-nanometer RF chips to the automotive sector.

Samsung has also shared its plans to expand its foundry capacity, with the investment and development of new manufacturing lines in Pyeongtaek (South Korea) and Taylor (Texas, United States). Pyeongtaek Line 3 will begin mass production of mobile chips in the second half of the year, while the Taylor plant is expected to be operational by the end of 2024.

The South Korean company has also announced the MDI Alliance, in collaboration with its partners and other industry players, to create an ecosystem of packaging technology for heterogeneous 2.5D and 3D integration.

Source: dpa

(Reference image source: Samsung, Europa Press / dpa)

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