Intel introduced its new solutions for encapsulated chips

The technology announced during the conference SEMICON West its new devices that integrates advanced techniques

Intel introduced its new advanced solutions for chip encapsulation, a physical interface that it considers has been “a critical, though often underestimated role,” in the electronic supply chain.

The encapsulation uses a physical capsule that provides a contact zone between the electrical signals of the chip and the power supply. Advanced encapsulation techniques allow the integration of multiple computer engines in various technological processes with performance parameters similar to that of a single cube, but with a wider range of platforms.

On the occasion of the SEMICON West conference held in San Francisco (United States), Intel announced its commitment to these advanced techniques with “an encapsulation format that provides the same functionality as a monolithic on-chip system (SoC)“. It was underlined by the corporate vice president for Testing Technology Development and Assembly of Intel, Babak Sabi.

During SEMICON West, Intel revealed three new technologies that they hope will “open a new dimension in product architecture,” led by Co-EMIB, which makes use of Intel’s EMIB and Foveros technologies, which take advantage of high-density interconnects to facilitate wide bandwidths with low consumption.

Co-EMIB allows two or more Foveros elements to be interconnected, their 3D microprocessor stacking technology that allows them to be placed one on top of the other to reach a performance almost identical to that of a single chip.

The second of the presented tools is ODI, the new technology of omnidirectional interconnection of Intel that provides more flexibility for the communication between chiplets in a same capsule, both horizontally and vertically, in this last case through routes through the silicon in the lower cube from the base.

Finally, Intel has revealed a new interface between cubes called MDIO, which allows a modular approach in the design of systems through a library of blocks of intellectual property of ‘chiplets’. MDIO provides greater energy efficiency and more than twice the pin speed and bandwidth density of AIB board systems.

K. Tovar

Source: EuropaPress

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